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职位月薪: 面议
岗位职责
1. Be responsible for the integration, testing, tear-down and other operations of the new product
负责新产品设备的集成、测试、拆除,及其他相关操作
2.Identify and resolve the issues in the new product tests, and provide solutions to the problems
发现并解决新产品测试中的问题,并提供问题解决方案
3.Record and analyze the final test data,develop troubleshooting guidelines
记录并分析测试数据,制定故障排除指南
4.Develop and refine the testing data record,methods and procedures
编制和完善测试方法和步骤
5.Improve the efficiency of new product testing and shorten cycle time and lead time
提高新品测试效率,能有效缩短C/T和L/T
6.Complete the KPIs at the individual level and the departmental level
完成个人层面及部门层面KPI
7. Other tasks assigned by the supervisor
主管交给的其他任务
岗位要求
1.硕士学历,应届毕业生。材料科学与工程、物理(等离子体物理、凝聚态物理优先)、电气工程及机械自动化(电气自动化、机械优先)、微电子科学与工程、电子科学与技术等相关理工科专业。
2.良好的实验设计和动手操作能力。
优秀的数据分析能力和逻辑思维能力,能熟练运用数据分析工具(如 Excel, Origin, JMP, Python, Matlab 等)。
3.优秀的英文读写能力,能阅读专业文献和技术文档。
4.了解半导体制造工艺流程,特别是刻蚀工艺和薄膜沉积工艺。
5.有使用真空设备、等离子体设备或相关表征设备的经验。
6.对半导体设备行业充满热情,强烈的学习意愿和能力,能够快速掌握新知识和新技能。
7.认真细致,有责任心,具备良好的实验安全意识。
8.积极主动,具备良好的沟通能力和团队协作精神。
具备较强的抗压能力和解决问题的韧性。
1. Master's degree, recent graduate (expected graduation in 2027). Relevant engineering or science disciplines including Materials Science and Engineering, Physics (with preference for plasma physics and condensed matter physics), Electrical Engineering and Mechanical Automation (with preference for electrical automation and mechanical engineering), Microelectronics Science and Engineering, Electronic Science and Technology, or related fields.
2. Strong experimental design and hands-on practical skills. Excellent data analysis and logical reasoning abilities, with proficiency in data analysis tools such as Excel, Origin, JMP, Python, and Matlab.
3. Strong English reading and writing skills, capable of comprehending technical literature and professional documents.
4. Familiarity with semiconductor manufacturing processes, particularly etching and thin-film deposition techniques.
5. Experience using vacuum equipment, plasma systems, or related characterization instruments.
6. Passionate about the semiconductor equipment industry, with strong motivation and learning ability to quickly acquire new knowledge and skills.
7. Detail-oriented, responsible, and committed to laboratory safety practices.
8. Proactive, with excellent communication skills and a collaborative team spirit. Capable of handling pressure and demonstrating resilience in problem-solving.
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1. Be responsible for the integration, testing, tear-down and other operations of the new product
负责新产品设备的集成、测试、拆除,及其他相关操作
2.Identify and resolve the issues in the new product tests, and provide solutions to the problems
发现并解决新产品测试中的问题,并提供问题解决方案
3.Record and analyze the final test data,develop troubleshooting guidelines
记录并分析测试数据,制定故障排除指南
4.Develop and refine the testing data record,methods and procedures
编制和完善测试方法和步骤
5.Improve the efficiency of new product testing and shorten cycle time and lead time
提高新品测试效率,能有效缩短C/T和L/T
6.Complete the KPIs at the individual level and the departmental level
完成个人层面及部门层面KPI
7. Other tasks assigned by the supervisor
主管交给的其他任务
岗位要求
1.硕士学历,应届毕业生。材料科学与工程、物理(等离子体物理、凝聚态物理优先)、电气工程及机械自动化(电气自动化、机械优先)、微电子科学与工程、电子科学与技术等相关理工科专业。
2.良好的实验设计和动手操作能力。
优秀的数据分析能力和逻辑思维能力,能熟练运用数据分析工具(如 Excel, Origin, JMP, Python, Matlab 等)。
3.优秀的英文读写能力,能阅读专业文献和技术文档。
4.了解半导体制造工艺流程,特别是刻蚀工艺和薄膜沉积工艺。
5.有使用真空设备、等离子体设备或相关表征设备的经验。
6.对半导体设备行业充满热情,强烈的学习意愿和能力,能够快速掌握新知识和新技能。
7.认真细致,有责任心,具备良好的实验安全意识。
8.积极主动,具备良好的沟通能力和团队协作精神。
具备较强的抗压能力和解决问题的韧性。
1. Master's degree, recent graduate (expected graduation in 2027). Relevant engineering or science disciplines including Materials Science and Engineering, Physics (with preference for plasma physics and condensed matter physics), Electrical Engineering and Mechanical Automation (with preference for electrical automation and mechanical engineering), Microelectronics Science and Engineering, Electronic Science and Technology, or related fields.
2. Strong experimental design and hands-on practical skills. Excellent data analysis and logical reasoning abilities, with proficiency in data analysis tools such as Excel, Origin, JMP, Python, and Matlab.
3. Strong English reading and writing skills, capable of comprehending technical literature and professional documents.
4. Familiarity with semiconductor manufacturing processes, particularly etching and thin-film deposition techniques.
5. Experience using vacuum equipment, plasma systems, or related characterization instruments.
6. Passionate about the semiconductor equipment industry, with strong motivation and learning ability to quickly acquire new knowledge and skills.
7. Detail-oriented, responsible, and committed to laboratory safety practices.
8. Proactive, with excellent communication skills and a collaborative team spirit. Capable of handling pressure and demonstrating resilience in problem-solving.
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