Key Responsibilities:

1. Conduct simulation projects, for flow, heat transfer, and chemistry/plasma phenomena in high

Knudsen number (Kn>0.1) regime, using particle based (DSMC for rarefied gas dynamics, PIC-MCC for plasma) modeling tools. In

particular, low pressure pumping flow and plasma in etch chambers, feature profile evolution due to etch / deposition process, surface process model development via molecular dynamics models, need to be covered

2. Analyze the simulation results, and document with the useful findings that will guide the optimization of product design and process recipe

3. Work with mechanical/process engineers to understand their issues, and explain the simulation findings and recommendation for improvement

Key Requirements:

PhD in plasma physics,

surface chemistry, or related field, with particle based modeling experiences

such as DSMC, etc.

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