Key Responsibilities

1.Lead the development and optimization of wafer-level electrochemical plating processes (e.g., Cu, SnAg, Au, Ni，) for new ECD equipment platforms. Define process parameters (current density, plating time, electrolyte flow rate, temperature, pH value) and establish process windows that ensure uniform film thickness, low defectivity (voids, seams, dendrites), and compliance with semiconductor industry standards (SEMI).

2.Collaborate closely with mechanical, electrical, and software engineers to integrate ECD process requirements into equipment design. Provide technical input on critical components such as plating cells, anode/cathode configurations, electrolyte circulation systems, wafer chucking mechanisms, and in-situ metrology tools (e.g., optical thickness monitors, resistivity sensors) to optimize process compatibility and performance.

3.Design and execute comprehensive process validation plans for new ECD equipment. Conduct experiments (DOE - Design of Experiments) to evaluate process stability, repeatability, and robustness across different wafer sizes (200mm/300mm) and technology nodes. Document process data, analyze results using statistical tools (Minitab, JMP), and generate qualification reports for internal and customer-facing reviews.

4.Identify root causes of plating-related defects (e.g., non-uniformity, pinholes, contamination) through collaboration with metrology and failure analysis teams. Develop and implement corrective actions, including process parameter adjustments, equipment component modifications, or electrolyte formulation optimizations, to improve process yield and reliability.

5.Work with chemical suppliers to evaluate and qualify ECD electrolytes, additives, and cleaning agents. Define chemical handling, storage, and disposal protocols that comply with safety and environmental regulations. Optimize electrolyte replenishment strategies to maintain process consistency and reduce operational costs.

6.Partner with customer technical teams (foundries, IDMs) to understand their specific ECD process requirements and translate them into equipment design specifications. Support sales and application engineering teams during customer demos, technical presentations, and on-site process trials.

7.Create and maintain technical documentation, including process flow diagrams, standard operating procedures (SOPs), equipment-process interface specifications, and R&D test reports. Contribute to the development of intellectual property (patents) related to novel ECD processes or equipment configurations.

Required Qualifications

•Bachelor’s or Master’s degree in Chemical Engineering, Materials Science, Electrical Engineering, or a related field. 5+ years of experience in semiconductor process engineering, with a focus on electrochemical plating (ECD)

•Deep technical knowledge of electrochemical plating principles, Hands-on experience with ECD equipment operation, process optimization, and defect troubleshooting in a semiconductor R&D or manufacturing environment. Familiarity with 300mm wafer processing is highly preferred.

•Strong understanding of semiconductor equipment design fundamentals, particularly for wet processing tools (ECD, cleaning, etching). Experience collaborating with mechanical/electrical engineering teams on equipment-process integration is a plus.

•Knowledge of SEMI standards, ISO quality management systems

•Excellent problem-solving skills, with the ability to conduct root cause analysis and implement data-driven corrective actions.

•Strong written and verbal communication skills, with the ability to document technical data, present findings to cross-functional teams, and collaborate effectively with internal and external stakeholders.

•Self-motivated, detail-oriented, and able to work independently in a fast-paced R&D environment.

Preferred Qualifications

•Ph.D. in Chemical Engineering, Hydrodynamics, Materials Science with a focus on electrochemical deposition.

•Experience in ECD equipment R&D is highly desirable.

•Familiarity with in-situ metrology tools for ECD process monitoring (e.g., ellipsometry, reflectometry, electrochemical impedance spectroscopy) will be a plus

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