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Senior/Staff/Principal SOC Design Engineer Introduction Arm China is looking for passionate computing subsystem/module individuals to form a best-in-class engineering team. Responsibilities •Perform subsystem/module design integration and peripheral modules IP development. •Write subsystem/module design specification. •Drive engineering feasibility analysis, micro-architecture evaluation and logic design review. •Perform PPA, system performance and reliability optimization. •Exercise various aspects of Design development flow evaluation and deployment. •Collaborate closely with DV, architect, subsystem and physical implementation stakeholders. •Lead/coach junior engineers. •Support customers regarding chip applications. Qualifications •Master of EE, CS, or related fields. •Requires 6 to 15 years of digital design experience. •Hands-on experience in RTL coding, micro-architecture spec derivation and subsystem design integration. •Master at least one of the following: oSoC/subsystem architecture oInterconnects/Bus oCPU/NPU/GPU/VPU/ISP/Display oPCIE/USB/MIPI/ETH/LSIO oDDR/ EMMC/UFS/QSPI/Cache oDebug & Trace •Good understanding on at least one of the listed subsystems is a plus: Automotive, Mobile, Server, AI, Modem SoC. •Mastery of problem solving, engineer enablement, as well as teamwork scope negotiation and commitment. •Ability to work under schedule pressure and meet targets without compromising on quality. •Highly proficient in English and Chinese. •Cross-site working experience is a plus. Our Culture We act with Belief—embracing uncertainty, owning challenges and driving solutions. With Solidarity, we align closely and back each other up. Staying Down-to-Earth, we drive efficiency, address customers’ real pain points and accelerate delivery. Fueled by Passion, we aim high, stay sharp, and never stop improving.
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您目前还没有登录:立即登录Senior/Staff/Principal SOC Design Engineer Introduction Arm China is looking for passionate computing subsystem/module individuals to form a best-in-class engineering team. Responsibilities •Perform subsystem/module design integration and peripheral modules IP development. •Write subsystem/module design specification. •Drive engineering feasibility analysis, micro-architecture evaluation and logic design review. •Perform PPA, system performance and reliability optimization. •Exercise various aspects of Design development flow evaluation and deployment. •Collaborate closely with DV, architect, subsystem and physical implementation stakeholders. •Lead/coach junior engineers. •Support customers regarding chip applications. Qualifications •Master of EE, CS, or related fields. •Requires 6 to 15 years of digital design experience. •Hands-on experience in RTL coding, micro-architecture spec derivation and subsystem design integration. •Master at least one of the following: oSoC/subsystem architecture oInterconnects/Bus oCPU/NPU/GPU/VPU/ISP/Display oPCIE/USB/MIPI/ETH/LSIO oDDR/ EMMC/UFS/QSPI/Cache oDebug & Trace •Good understanding on at least one of the listed subsystems is a plus: Automotive, Mobile, Server, AI, Modem SoC. •Mastery of problem solving, engineer enablement, as well as teamwork scope negotiation and commitment. •Ability to work under schedule pressure and meet targets without compromising on quality. •Highly proficient in English and Chinese. •Cross-site working experience is a plus. Our Culture We act with Belief—embracing uncertainty, owning challenges and driving solutions. With Solidarity, we align closely and back each other up. Staying Down-to-Earth, we drive efficiency, address customers’ real pain points and accelerate delivery. Fueled by Passion, we aim high, stay sharp, and never stop improving.
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